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glue(Lens bonding) - List of Manufacturers, Suppliers, Companies and Products

glue Product List

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Camera Module Adhesive Catalog

High-performance adhesive for camera modules.

This catalog introduces H.B. Fuller’s adhesives for electronics. We have a wide range of products applicable to the latest camera modules, including those for housing bonding, active alignment, die attach, and FPC reinforcement. Please make use of this for product selection. 【Featured Products (excerpt)】 - Low-temperature curing adhesives - UV curing adhesives - UV/thermal or UV/moisture dual curing adhesives - Underfill materials, etc. *For more details, please feel free to contact us.

  • Other optical parts

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Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • 導電性シリンジ.jpg
  • Chip type LED
  • Dedicated IC
  • IC tag

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"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and stretchability with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Circular Connectors
  • Rectangular Connector
  • Automotive Connectors

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Adhesive for Hard Disk Drives

It demonstrates high reliability in the assembly of hard disk drives.

This is an adhesive with a long track record in hard disk drive assembly. Characteristics: Low outgassing, low-temperature curing, oil-resistant, halogen-free. NIC BOND (part number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

  • NB1001(1).jpg
  • Other motors
  • Optical Connector
  • Other electronic parts

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[Market Report] Global Market for Elastic Adhesives

The global market for elastic adhesives is expected to grow rapidly, reaching 35.08 billion USD by 2031, with a notable CAGR of 6.6%.

The global market for elastic adhesives is expected to see significant expansion driven by advancements in adhesive technology and applications across diverse industries. The market size in 2022 was estimated at $19.74 billion, and it is projected to achieve a remarkable valuation of $35.08 billion by 2031. This growth trajectory is supported by a robust compound annual growth rate (CAGR) of 6.6% from 2023 to 2031. Elastic adhesives are attracting attention across a wide range of industries, from construction to automotive, healthcare, and packaging. These versatile adhesives are valued for their ability to provide flexible bonding solutions that adapt to various stress levels, temperature fluctuations, and substrate characteristics. You can check the application method by clicking the [PDF Download] button or apply directly through the related links.

  • others

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